Printed Circuit Boards

Standard Double Sided, Multilayer PCBs

In today's world of complex Interconnections, the choice of packaging is governed by factors like, Cost, Electrical requirements, Thermal requirements and so on. All things considered, standard PCBs still play important role in Electronic packaging.

High Density Interconnect

Factors driving PCBs that require higher wiring densities are,

  • More number of components be placed in a smaller area of the PCB.
  • Components be placed on both sides of the PCB.
  • Components being closely placed on the board.
  • The size and pitch of components reduce while the number of Inputs/Outputs increase.
  • Smaller geometries and also faster transmission of signal reduce signal crossing delay.
  • Many other advantages like Design / Cost / Performance tradeoffs has pushed present day designers to look for HDI designs.

Rigid-Flex PCBs

Multilayer rigid / flexible circuits have been effective in reducing wiring space and increasing wiring reliability in aerospace, consumer electronics and position where hinge wiring is required for mechanical moving parts. Only flexible circuits could satisfy such wiring requirements.

Thermally Conductive PCBs

Aluminium PCBs use dielectric which is thermally conductive and electrically insulate material between the copper layer and Aluminium sheet. Such PCBs have wide range of applications which involve heat dissipation, and also maintaining and controlling the overall temperature.